With high self-sharpness and excellent cutting ability, resin bond blade is a kind of dicing blade formed by hot pressing with resin powder as binder and diamond and cubic boron nitride as abrasive. With the advantages of bonds and different concentrations of abrasives, the cutting quality can be effectively controlled. By diverse bonds and original material mixing process, the uniform dispersion of nano materials can be realized without agglomeration. The resin bond blades are widely used in precision cutting of glass, ceramics, QFN, DFN, BGA, LGA and other different materials. 

Product Characteristics

• New bonds can be invented to meet various requirements according to the characteristics of processing materials.

• Different specifications of dicing blades can be customized by customers. By adjusting concentration, the cutting quality and blade life can be effectively controlled.

• With new mixing and hot pressing technology, stable product quality can be ensured. 

Applications

Various semiconductor packaging components (QFN, BGA), optical glass, quartz glass and ceramics, etc.