By adopting ultra-high precision matrix processing technology, advanced electroforming solution formula and unique diamond dispersion technology, Sail Technology can produce the hub blades with stronger rigidity and narrower kerf according to the higher cutting edge standard, especially the ZZ series with kerf 10-15 μ, which can support ultra-fine cutting path processing.
GaAs, oxide wafers (LiTaO3, LiNbO3), silicon wafer, etc.

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