苏州赛尔科技有限公司

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S200 Series Hub Blade
S200 Series Hub Blade
S200 Series Hub Blade

With advanced matrix processing technology, progressive electroforming method, and unique diamond dispersion technology, Suzhou Sail Science& Technology Co., Ltd. can make hub blades with different specifications, hardness and concentration. Different craft and formula are used for different customers. With the promise of meeting customers’ cutting requirements, we can also effectively improve the quality and life of the dicing blades.
GaAs, oxide wafers (LiTaO3, LiNbO3), silicon wafer, etc

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产品详情 Product Details

With advanced matrix processing technology, progressive electroforming method, and unique diamond dispersion technology, Suzhou Sail Science& Technology Co., Ltd. can make hub blades with different specifications, hardness and concentration. Different craft and formula are used for different customers. With the promise of meeting customers’ cutting requirements, we can also effectively improve the quality and life of the dicing blades. 


Applications

GaAs, oxide wafers (LiTaO3, LiNbO3), silicon wafer, etc 


S200

4000#

C

BH6

21

52

Type

Grit Size

Concentration

Bond

kerf

Exp

S200

2000#

A

BH3

15-20

380-510


3000#

B

BH4

21-25

511-640


3500#

C

BH5

26-30

641-760


4000#

D

BH6

31-35

761-890


4500#

E


36-40

891-1020


4800#

F





5000#






Kerf/μm

Exp/μm

380-510

511-640

891-1020

1021-1140

1141-1270

15-20

1639





21-25

2139

2152




26-30

2639

2652




31-35

3139

3152




36-40


3652

3690



41-50


4152

4190

41102


51-60



5190

51102

51114


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