With advanced matrix processing technology, progressive electroforming method, and unique diamond dispersion technology, Suzhou Sail Science& Technology Co., Ltd. can make hub blades with different specifications, hardness and concentration. Different craft and formula are used for different customers. With the promise of meeting customers’ cutting requirements, we can also effectively improve the quality and life of the dicing blades. GaAs, oxide wafers (LiTaO3, LiNbO3), silicon wafer, etc
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With advanced matrix processing technology, progressive electroforming method, and unique diamond dispersion technology, Suzhou Sail Science& Technology Co., Ltd. can make hub blades with different specifications, hardness and concentration. Different craft and formula are used for different customers. With the promise of meeting customers’ cutting requirements, we can also effectively improve the quality and life of the dicing blades.
Applications
GaAs, oxide wafers (LiTaO3, LiNbO3), silicon wafer, etc
S200 | 4000# | C | BH6 | 21 | 52 |
Type | Grit Size | Concentration | Bond | kerf | Exp |
S200 | 2000# | A | BH3 | 15-20 | 380-510 |
3000# | B | BH4 | 21-25 | 511-640 | |
3500# | C | BH5 | 26-30 | 641-760 | |
4000# | D | BH6 | 31-35 | 761-890 | |
4500# | E | 36-40 | 891-1020 | ||
4800# | F | ||||
5000# |
Kerf/μm | Exp/μm | ||||
380-510 | 511-640 | 891-1020 | 1021-1140 | 1141-1270 | |
15-20 | 1639 | ||||
21-25 | 2139 | 2152 | |||
26-30 | 2639 | 2652 | |||
31-35 | 3139 | 3152 | |||
36-40 | 3652 | 3690 | |||
41-50 | 4152 | 4190 | 41102 | ||
51-60 | 5190 | 51102 | 51114 |