苏州赛尔科技有限公司

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S20 Series Hub Blade
S20 Series Hub Blade
S20 Series Hub Blade

​With advanced electroplating process and unique diamond dispersion technology, Suzhou Sail Science& Technology Co., Ltd. can make hub blades with different specifications, hardness and concentration. Different craft and formula are used for different customers. With the promise of meeting customers’ cutting requirements, we can also effectively improve the quality and life of the dicing blades.
PCB, BGA, ceramic substrate materials, silicon wafer, etc.

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产品详情 Product Details

With advanced electroplating process and unique diamond dispersion technology, Suzhou Sail Science& Technology Co., Ltd. can make hub blades with different specifications, hardness and concentration. Different craft and formula are used for different customers. With the promise of meeting customers’ cutting requirements, we can also effectively improve the quality and life of the dicing blades.


Applications

PCB, BGA, ceramic substrate materials, silicon wafer, etc. 


Type

Grit Size

Bond

Concentration

kerf

Exp

S20

4000#

BH3

A

15-20

380-510


3500#

BH4

B

21-25

511-640


3000#

BH5

C

26-30

641-760


2000#

BH6

D

31-25

761-890




E

36-40

891-1020




F




Kerf/μm

Exp/μm

380-510

511-640

891-1020

1021-1140

1141-1270

15-20

1639





21-25

2139

2152




26-30

2639

2652




31-35

3139

3152




36-40


3652

3690



41-50


4152

4190

41102


51-60



5190

51102

51114


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