With advanced electroplating process and unique diamond dispersion technology, Suzhou Sail Science& Technology Co., Ltd. can make hub blades with different specifications, hardness and concentration. Different craft and formula are used for different customers. With the promise of meeting customers’ cutting requirements, we can also effectively improve the quality and life of the dicing blades. PCB, BGA, ceramic substrate materials, silicon wafer, etc.
24小时服务热线0512-62968903
With advanced electroplating process and unique diamond dispersion technology, Suzhou Sail Science& Technology Co., Ltd. can make hub blades with different specifications, hardness and concentration. Different craft and formula are used for different customers. With the promise of meeting customers’ cutting requirements, we can also effectively improve the quality and life of the dicing blades.
Applications
PCB, BGA, ceramic substrate materials, silicon wafer, etc.
Type | Grit Size | Bond | Concentration | kerf | Exp |
S20 | 4000# | BH3 | A | 15-20 | 380-510 |
3500# | BH4 | B | 21-25 | 511-640 | |
3000# | BH5 | C | 26-30 | 641-760 | |
2000# | BH6 | D | 31-25 | 761-890 | |
E | 36-40 | 891-1020 | |||
F |
Kerf/μm | Exp/μm | ||||
380-510 | 511-640 | 891-1020 | 1021-1140 | 1141-1270 | |
15-20 | 1639 | ||||
21-25 | 2139 | 2152 | |||
26-30 | 2639 | 2652 | |||
31-35 | 3139 | 3152 | |||
36-40 | 3652 | 3690 | |||
41-50 | 4152 | 4190 | 41102 | ||
51-60 | 5190 | 51102 | 51114 |