This series of products are mainly used in semiconductor wafer thinning and finishing. 

Product Characteristics

• High self sharpening property with porous ceramic bond 

• Processing efficiency is greatly improved with high feed speed, up to 500um / min

• Unique bond formula, excellent processing quality, low wear and long service life

• The wheels can be customized according to customer's requirements and suitable grinding wheels can be provided according to different machines and grinding processes

Applications

Discrete devices, integrated circuit substrate, silicon wafer and original silicon chip, etc