The Metal-bond Grinding Wheels are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium and GaN wafer. This kind of grinding wheels of our company can replace imported products. 

Product Characteristics: 

• High precision, good quality on surface

• Good shape retention

• High grinding efficiency 

• Low grinding force and low grinding temperature

加工对象

Sapphire epitaxial wafer, silicon wafer, GaAs, GaN wafer